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Wire Bonding

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Specifications:
• Capable of handling bare Cu wire and Pd coated Cu wire, achievi ng high speed bonding of 45ms/2mm
• Bonding accuracy of ±2.0μm (3σ) achieved
• Shorter product-type changeover time achieved by digitalizing the flow rate of inert gas
• Wire bonder with new SimLoop as a standard function
• Reduced working time with Automated loop shape optimization and Loop shape editor
• Approx. 7% UPH improvement by Overdrive mode
• Bonding Accuracy: ±2.0 μm(3σ)Using Shinkawa standard device
• Correction of Bonding Position: System to check and correct capillary offset prior to bonding through Shinkawa RPS
(In combination with offset amount correction with temperature detection)
• Bonding Speed: 45 ms/2 mm wire with loop control and force detection mode Using Shinkawa standard device
• Bonding Wire Length: 8 mm maximum (Varies depending on device conditions)
• Resolution: XY-table: 0.1 μm Z-axis: 0.1 μm
• Vibration Control: Shinkawa NRS - Non Reaction Servo System
• Bonding Area: X:±28 mm, Y:±43.5 mm
• Wire Size: Au / Cu φ15–50 μm
• Bonding Force: 3–1,000gf
• No. of Bonding Wires: 30,000 wires maximum
• Loader/Unloader: Fully automatic magazine stacker system (Option: stocker system))
• Workpiece Size: Width: 20– 95 mm (20–93 mm when carrier type),Length: 95–300 mm,
• Thickness: 0.07–2.0 mm (Varies depending on type of device)
(Conversion parts are required when thickness changes)
• Production Management: Management of equipment availability through production management monitoring screen


Specifications:
• Platform that achieved high speed bonding of 42ms/0.7mm (45ms/2 mm) with completely updated X, Y and Z motors
• Bonding accuracy of±3.0μm(3σ)achieved
• Capable of indexing 102mm x 300mm lead frames by allowing Y bonding area of 95mm
• Simultaneous detection and bonding capability in X and Y directions
• Bonding Accuracy: ±3.0 μm (3 σ), (The bonding accuracy changes depending on the conditions of device and temperature)
• Bonding Speed: 42 ms/0.7 mm wire (45 ms/2 mm wire)
(with loop control and force detection mode) Using Shinkawa standard device
• Bonding Wire Length: 4 mm maximum (Varies depending on device conditions)
• Resolution: XY table: 0.1 μm, Z-axis: 0.1 μm
• Vibration Control: Shinkawa NRS - Non Reaction Servo System
• Bonding Area: X: 66mm - Camera offset, Y: 95mm - Camera offset
• Wire Size: φ18–50 μm
• Bonding Force: 3–1,000 gf
• No. of Bonding Wires: 12,000 wires maximum
• Loader / Unloader: Fully automatic magazine stacker system (Option: stocker system)
• Workpiece Size: Width :20–102 mm, Length: 95–300 mm,
• Thickness :0.1 - 0.5 mm (Varies depending on type of device)
(Conversion parts are required when thickness changes)
• Production Management: Management of equipment availability through production management monitoring screen


Specifications:
• Platform that achieved high speed bonding of 45ms/2mm with completely updated X, Y and Z motors
• Bonding accuracy of ±2.0μm (3σ) achieved
• Capable of high quality bonding with QFN devices and heavy Cu wire by installing a bonding head with a maximum bond force of 1,000gf and high rigidity transducer
• Equipped with electric flame-off unit capable of handling wire sizes φ15-50μm without changing unit
• Wire bonder with new SimLoop as a standard function
• Reduced working time with Automated loop shape optimization and Loop shape editor
• Approx. 7% UPH improvement by Overdrive mode
• Bonding Accuracy: ±2.0 μm(3σ)Using Shinkawa standard device
• Correction of Bonding Position: System to check and correct capillary offset prior to bonding through Shinkawa RPS
(In combination with offset amount correction with temperature detection)
• Bonding Speed: 45 ms/2 mm wire with loop control and force detection mode Using Shinkawa standard device
• Bonding Wire Length: 8 mm maximum (Varies depending on device conditions)
• Resolution: XY-table: 0.1 μm Z-axis: 0.1 μm
• Vibration Control: Shinkawa NRS - Non Reaction Servo System
• Bonding Area: X:±28 mm, Y:±43.5 mm
• Wire Size: Au φ15–50 μm (Bump bonding φ15–30 μm)
• Bonding Force: 3–1,000gf
• No. of Bonding Wires: 30,000 wires maximum
• Loader/Unloader: Fully automatic magazine stacker system (Option: stocker system))
• Workpiece Size: Width: 20– 95 mm (20–93 mm when carrier type),Length: 95–300 mm,
• Thickness: 0.07–2.0 mm (Varies depending on type of device)
(Conversion parts are required when thickness changes)
• Production Management: Management of equipment availability through production management monitoring screen